Ableteccom C1 Datasheet Hot! Jun 2026
| Parameter | Conditions | Typical Value | Unit | | :--- | :--- | :--- | :--- | | | $R_L = 4\Omega$, THD+N < 0.5% | $2 \times 100$ | W | | Rated Output Power (Stereo) | $R_L = 8\Omega$, THD+N < 0.5% | $2 \times 60$ | W | | Peak Output Power | $R_L = 4\Omega$, Burst | $2 \times 150$ | W | | Bridged Mode (Mono) | $R_L = 8\Omega$ (if supported) | 200 | W |
One of the standout features of Abletec modules is the integrated output filter. The C1 typically includes a high-quality low-pass filter on the output stage, meaning you don't need to solder external inductors or capacitors to make the amp "speaker ready." This reduces component count and PCB real estate in your DIY builds.
ABLETEC.COM C1 Datasheet: Technical Specifications, Architecture, and Application Guide ableteccom c1 datasheet
While there is no single document labeled as the , "Abletec" (now part of Anaview) is a well-known manufacturer of high-performance Class D amplifier modules. The "C1" designation in high-end audio often refers to the B.M.C. Audio Amplifier C1 , a legendary integrated amplifier that utilizes sophisticated proprietary technology often discussed alongside Abletec modules in audiophile circles.
The "C1" chip is an internal component of the larger amplifier modules used by brands like TEAC and Shanling . Max Power Output Devices Using This Tech 50W x 2 @ 4Ω Shanling EA5 Streamer 120W x 2 @ 4Ω TEAC AX-501 Amplifier 320W x 1 @ 4Ω Custom Monoblocks & Subwoofers 🔍 Related Components | Parameter | Conditions | Typical Value |
The module is renowned for its compact form factor, high reliability, and "audiophile-grade" performance, offering low distortion and high dynamic range suitable for critical listening applications.
Based on available market information, the is a high-performance integrated circuit (IC) primarily utilized as a specialized driver, commonly associated with the IRS20956S architecture in SMD (SOP-16) packaging . It is highly sought after for audio amplifier modules, automotive control systems, and complex signal processing applications. The "C1" designation in high-end audio often refers to the B
: Utilize heavy internal copper fills linked by thermal vias directly beneath the SOP-16 package footprint to dissipate heat away from the silicon die.